Galvano Technique

Our probes can be used to determine the concentration of electroplating solutions (for example, copper or nickel).

With the control units developed to control the concentration is possible.

1998: Density-Controller

  • Two measuring and control circuits to control Ni concentration and Ni density

1998: Quartz Micro Balance

  • Measuring head for determining the Ni- order on surfaces.

 

1997: Cu-Amplifier

  • Interface for Cu-Immersion probes and Ni-Measuring cells

1996: Cu-Controller

  • Measuring and control circuit for controlling the concentration of Cu

 

1995: Ni – Controller III

  • Two measuring and control circuits to control the concentration and pH of the Ni

1985: Controllomat-M

  • Measuring and control circuit for the concentration of Cu baths in printed circuit board production

 

1983: Controllomat 3A

  • Measuring and control device for 3 or 4 electroplating baths
  • Redox, pH and concentration measurement with pump control

1981: Ni – Measuring Cell

  • Measuring cell for chem. nickel
  • Optical measuring cell for concentration control of electroplating baths

 

1981: Immersion Probe

  • Immersion Probe Typ Q, E, T
  • Optical measuring probe for controlling the concentration of Cu in electroplating baths