Our probes can be used to determine the concentration of electroplating solutions (for example, copper or nickel).
With the control units developed to control the concentration is possible.
1998: Density-Controller
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Two measuring and control circuits to control Ni concentration and Ni density
1998: Quartz Micro Balance
- Measuring head for determining the Ni- order on surfaces.
1997: Cu-Amplifier
- Interface for Cu-Immersion probes and Ni-Measuring cells
1996: Cu-Controller
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Measuring and control circuit for controlling the concentration of Cu
1995: Ni – Controller III
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Two measuring and control circuits to control the concentration and pH of the Ni
1985: Controllomat-M
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Measuring and control circuit for the concentration of Cu baths in printed circuit board production
1983: Controllomat 3A
- Measuring and control device for 3 or 4 electroplating baths
- Redox, pH and concentration measurement with pump control
1981: Ni – Measuring Cell
- Measuring cell for chem. nickel
- Optical measuring cell for concentration control of electroplating baths
1981: Immersion Probe
- Immersion Probe Typ Q, E, T
- Optical measuring probe for controlling the concentration of Cu in electroplating baths